AC08FSM datasheet(144/223 Pages) TECCOR

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AN1004

Application Notes

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AN1004 - 2

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Thyristor Product Catalog

Figure AN1004.2

Lead Bending Method

When bending leads in the plane of the leads (spreading), bend

only the narrow part. Sharp angle bends should be done only

once as repetitive bending will fatigue and break the leads.

The mounting tab of the TO-202 package may also be bent or

formed into any convenient shape as long as it is held firmly

between the plastic case and the area to be formed or bent. With-

out this precaution, bending the tab may fracture the chip and

permanently damage the unit.

Heat Sinking

Use of the largest, most efficient heat sink as is practical and cost

effective extends device life and increases reliability. In the illus-

tration shown in Figure AN1004.3, each device is electrically iso-

lated.

Figure AN1004.3

Several Isolated TO-220 Devices Mounted to a

Common Heat Sink

Many power device failures are a direct result of improper

heat dissipation. Heat sinks with a mating area smaller than the

metal tab of the device are unacceptable. Heat sinking material

should be at least 0.062" thick to be effective and efficient.

Note that in all applications the maximum case temperature (TC)

rating of the device must not be exceeded. Refer to the individual

device data sheet rating curves (TC versus IT) as well as the indi-

vidual device outline drawings for correct TC measurement point.

Figure AN1004.4 through Figure AN1004.6 show additional

examples of acceptable heat sinks.

Figure AN1004.4

Examples of PC Board Mounts

Figure AN1004.5

Vertical Mount Heat Sink

Several types of vertical mount heat sinks are available. Keep

heat sink vertical for maximum convection.

Figure AN1004.6

Examples of Extruded Aluminum

When coupled with fans, extruded aluminum mounts have the

highest efficiency.

Heat Sinking Notes

Care should be taken not to mount heat sinks near other heat-

producing elements such as power resistors, because black

anodized heat sinks may absorb more heat than they dissipate.

Some heat sinks can hold several power devices. Make sure that

if they are in electrical contact to the heat sink, the devices do not

short-circuit the desired functions. Isolate the devices electrically

or move to another location. Recall that the mounting tab of Tec-

cor isolated TO-220 devices is electrically isolated so that several

devices may be mounted on the same heat sink without extra

insulating components. If using an external insulator such as

mica, with a thickness of 0.004", an additional thermal resistance

of 0.8° C/W for TO-220 or 0.5° C/W for TO-218 devices is added

to the RθJC device rating.

Incorrect

(A)

(B)

Correct

Heat Sink

Printed

Circuit

Board

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