AC08FSM datasheet(147/223 Pages) TECCOR

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Application Notes

AN1004

AN1004 - 5

http://www.teccor.com

Thyristor Product Catalog

+1 972-580-7777

Soldering Of Leads

A prime consideration in soldering leads is the soldering of

device leads into PC boards, heat sinks, and so on. Significant

damage can be done to the device through improper soldering. In

any soldering process, do not exceed the data sheet lead solder

temperature of +230

°C for 10 seconds, maximum, ≥1/16" from

the case.

This application note presents details about the following three

types of soldering:

•

Hand soldering

•

Wave soldering

•

Dip soldering

Hand Soldering

This method is mostly used in prototype breadboarding applica-

tions and production of small modules. It has the greatest poten-

tial for misuse. The following recommendations apply to Teccor

TO-92, TO-202, TO-220, and TO-218 packages.

Select a small- to medium-duty electric soldering iron of 25 W to

45 W designed for electrical assembly application. Tip tempera-

ture should be rated from 600 °F to 800 °F (300 °C to 425 °C).

The iron should have sufficient heat capacity to heat the joint

quickly and efficiently in order to minimize contact time to the

part. Pencil tip probes work very well. Neither heavy-duty electri-

cal irons of greater than 45 W nor flame-heated irons and large

heavy tips are recommended, as the tip temperatures are far too

high and uncontrollable and can easily exceed the time-tempera-

ture limit of the part.

Teccor Fastpak devices require a different soldering technique.

Circuit connection can be done by either quick-connect terminals

or solder.

Since most quick-connect 0.250” female terminals have a maxi-

mum rating of 30 A, connection to terminals should be made by

soldering wires instead of quick-connects.

Recommended wire is 10 AWG stranded wire for use with MT1

and MT2 for load currents above 30 A. Soldering should be per-

formed with a 100-watt soldering iron. The iron should not remain

in contact with the wire and terminal longer than 40 seconds so

the Fastpak triac is not damaged.

For the Teccor TO-218X package, the basic rules for hand sol-

dering apply; however, a larger iron may be required to apply suf-

ficient heat to the larger leads to efficiently solder the joint.

Remember not to exceed the lead solder temperatures of

+230 °C for 10 seconds, maximum,

≥1/16" (1.59mm) from the

case.

A 60/40 or 63/37 Sn/Pb solder is acceptable. This low melting-

point solder, used in conjunction with a mildly activated rosin flux,

is recommended.

Insert the device into the PC board and, if required, attach the

device to the heat sink before soldering. Each lead should be

individually heat sinked as it is soldered. Commercially available

heat sink clips are excellent for this use. Hemostats may also be

used if available. Needle-nose pliers are a good heat sink choice;

however, they are not as handy as stand-alone type clips.

In any case, the lead should be clipped or grasped between the

solder joint and the case, as near to the joint as possible. Avoid

straining or twisting the lead in any way.

Use a clean pre-tinned iron, and solder the joint as quickly as

possible. Avoid overheating the joint or bringing the iron or solder

into contact with other leads that are not heat sinked.

Wave Solder

Wave soldering is one of the most efficient methods of soldering

large numbers of PC boards quickly and effectively. Guidelines

for soldering by this method are supplied by equipment manufac-

turers. The boards should be pre-heated to avoid thermal shock

to semiconductor components, and the time-temperature cycle in

the solder wave should be regulated to avoid heating the device

beyond the recommended temperature rating. A mildly activated

resin flux is recommended. Figure AN1004.12 shows typical heat

and time conditions.

Figure AN1004.12

Reflow Soldering with Pre-heating

Dip Soldering

Dip soldering is very similar to wave soldering, but it is a hand

operation. Follow the same considerations as for wave soldering,

particularly the time-temperature cycle which may become oper-

ator dependent because of the wide process variations that may

occur. This method is not recommended.

Board or device clean-up is left to the discretion of the customer.

Teccor devices are tolerant of a wide variety of solvents, and they

conform to MIL-STD 202E method 215 “Resistance to Solvents.”

Time (Seconds)

100

120

140

160

180

200

220

240

120

150

180

210

240

270

300

Pre-heat

Soak

Reflow

Cool

Down

0.5 - 0.6 ˚C/s

1.3 - 1.6 ˚C/s

<2.5 ˚C/s

Peak Temperature

220 ˚C - 245 ˚C

Soaking Zone

Reflow Zone

Pre-heating Zone

( 2 min. MAX )

60 - 90 s typical

( 2-4 min MAX )

( 2 min. MAX )

30 - 60 s typical

260

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