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LPC802 Scheda tecnica(PDF) 70 Page - NXP Semiconductors |
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LPC802 Scheda tecnica(HTML) 70 Page - NXP Semiconductors |
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70 / 83 page ![]() LPC802 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2018. All rights reserved. Product data sheet Rev. 1.6 — 27 April 2018 70 of 83 NXP Semiconductors LPC802 32-bit ARM Cortex-M0+ microcontroller Fig 37. Package outline HVQFN33 (5 x 5 x 0.85 mm) References Outline version European projection Issue date IEC JEDEC JEITA MO-220 hvqfn33f_po 11-10-11 11-10-17 Unit(1) mm max nom min 0.85 0.05 0.00 0.2 5.1 4.9 3.75 3.45 5.1 4.9 3.75 3.45 0.5 3.5 A1 Dimensions (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm bc 0.30 0.18 D(1) A(1) Dh E(1) Eh ee1 e2 L 3.5 vw 0.1 0.1 y 0.05 0.5 0.3 y1 0.05 0 2.5 5 mm scale 1/2 e A C B v C w terminal 1 index area A A1 c detail X y y1 C e L Eh Dh e e1 b 916 32 25 24 17 8 1 X D E C B A e2 terminal 1 index area 1/2 e |
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