IR2114/IR21141/IR2214/IR22141

2

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All

The thermal resistance and power dissipation ratings are measured under board mounted and still air

conditions.

Symbol

Definition

Min.

Max.

Units

High side offset voltage

High side floating supply voltage

(IR2114 or IR21141)

-0.3

625

(IR2214 or IR22141)

-0.3

1225

High side floating output voltage (HOP, HON and SSDH)

Low side and logic fixed supply voltage

-0.3

25

COM

Power ground

Low side output voltage (LOP, LON and SSDL)

Logic input voltage (HIN, LIN and FLT_CLR)

FAULT input/output voltage (FAULT/SD and SY_FLT)

High side DS input voltage

Low side DS input voltage

V

dVs/dt

Allowable offset voltage slew rate

—

50

V/ns

Package power dissipation @ TA ≤ +25°C

—

1.5

W

Thermal resistance, junction to ambient

—

65

°C/W

Junction temperature

—

125

Storage temperature

-55

150

Lead temperature (soldering, 10 seconds)

—

300

°C

Recommended Operating Conditions

For proper operation the device should be used within the recommended conditions. All voltage parameters

differential.

Symbol

Definition

Min.

Max.

Units

High side floating supply voltage (Note 1)

(IR2114 or IR21141)

Note 2

600

High side floating supply offset

voltage

(IR2214 or IR22141)

Note 2

1200

High side output voltage (HOP, HON and SSDH)

Low side output voltage (LOP, LON and SSDL)

Low side and logic fixed supply voltage (Note 1)

11.5

20

COM

Power ground

-5

5

Logic input voltage (HIN, LIN and FLT_CLR)

Fault input/output voltage (FAULT/SD and SY_FLT)

High side DS pin input voltage

Low side DS pin input voltage

V

Ambient temperature

-40

125

°C

Note 1: While internal circuitry is operational below the indicated supply voltages, the UV lockout disables

the output drivers if the UV thresholds are not reached.