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DRV8426PWPR Scheda tecnica(PDF) 39 Page - Texas Instruments |
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DRV8426PWPR Scheda tecnica(HTML) 39 Page - Texas Instruments |
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39 / 49 page ![]() www.ti.com PACKAGE OUTLINE C SEE TERMINAL DETAIL 24X 0.3 0.2 2.45 0.1 24X 0.5 0.3 1 MAX (0.2) TYP 0.05 0.00 20X 0.5 2X 2.5 2X 2.5 A 4.1 3.9 B 4.1 3.9 0.3 0.2 0.5 0.3 VQFN - 1 mm max height RGE0024B PLASTIC QUAD FLATPACK - NO LEAD 4219013/A 05/2017 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 6 13 18 7 12 24 19 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD 25 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.000 DETAIL OPTIONAL TERMINAL TYPICAL 39 DRV8426 www.ti.com SLOSE55 – MAY 2020 Product Folder Links: DRV8426 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated |
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