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ISO6721 Scheda tecnica(PDF) 6 Page - Texas Instruments |
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ISO6721 Scheda tecnica(HTML) 6 Page - Texas Instruments |
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6 / 38 page ![]() 6.4 Thermal Information THERMAL METRIC (1) ISO6721B UNIT D (SOIC) 8 PINS RθJA Junction-to-ambient thermal resistance 104.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 48.9 °C/W RθJB Junction-to-board thermal resistance 52.9 °C/W ψJT Junction-to-top characterization parameter 7.9 °C/W ψJB Junction-to-board characterization parameter 52.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W 6.5 Power Ratings PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ISO6721B PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 25-MHz 50% duty cycle square wave 72.7 mW PD1 Maximum power dissipation (side-1) VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 25-MHz 50% duty cycle square wave 36.35 mW PD2 Maximum power dissipation (side-2) VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 25-MHz 50% duty cycle square wave 36.35 mW ISO6721 SLLSFJ0 – JULY 2020 www.ti.com 6 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: ISO6721 |
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