PIMXRT406LCAE4A datasheet(18/71 Pages) NXP

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i.MX RT1015 Crossover Processors Data Sheet for Industrial Products, Rev. 2, 03/2021

NXP Semiconductors

Electrical characteristics

— Starts up quicker than 32 kHz crystal oscillator

•

External crystal oscillator with on-chip support circuit:

— At power up, ring oscillator is utilized. After crystal oscillator is stable, the clock circuit

switches over to the crystal oscillator automatically.

— Higher accuracy than ring oscillator

— If no external crystal is present, then the ring oscillator is utilized

The decision of choosing a clock source should be taken based on real-time clock use and precision

time-out.

4.1.5

Maximum supply currents

The data shown in Table 11 represent a use case designed specifically to show the maximum current

consumption possible. All cores are running at the defined maximum frequency and are limited to L1

cache accesses only to ensure no pipeline stalls. Although a valid condition, it would have a very limited

practical use case, if at all, and be limited to an extremely low duty cycle unless the intention was to

specifically show the worst case power consumption.

See the i.MX RT1015 Power Consumption Measurement Application Note for more details on typical

power consumption under various use case definitions.

Table 11. Maximum supply currents

Power Rail

Conditions

Max Current

Unit

DCDC_IN

Max power for chip at 105 oC with core

mark run on FlexRAM

VDD_HIGH_IN

Include internal loading in analog

VDD_SNVS_IN

—

250

A

USB_OTG1_VBUS

25 mA for each active USB interface

VDDA_ADC_3P3

3.3 V power supply for 12-bit ADC, 600

A typical, 750 A max, for each ADC.

100 Ohm max loading for touch panel,

cause 33 mA current.

NVCC_GPIO

Imax = N x C x V x (0.5 x F)

Where:

N—Number of IO pins supplied by the power line

C—Equivalent external capacitive load

V—IO voltage

(0.5 x F)—Data change rate. Up to 0.5 of the clock rate (F).

In this equation, Imax is in Amps, C in Farads, V in Volts, and F in Hertz.

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