AVDD to EP* ........................................................-0.5V to +1.9V

DVDD to EP*........................................................-0.5V to +1.9V

IOVDD to EP*.......................................................-0.5V to +3.9V

LMN_ to EP* (15mA current limit) ........................-0.5V to +3.9V

IN_+, IN_- to EP*..................................................-0.5V to +1.9V

All Other Pins to EP*......................... -0.5V to (IOVDD + 0.5V)V

IN_+, IN_- Short Circuit to Ground or Supply ...........Continuous

Operating Temperature Range..........................-40°C to +115°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -40°C to +150°C

Soldering Temperature (reflow).......................................+260°C

(derate 34.5 mW/°C above +70°C.) ......................2758.6mW

*EP connected to IC ground.

For the latest package outline information and land patterns (footprints), go to

www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

32-Pin TQFN-EP

PACKAGE CODE

T3255+8

Outline Number

21-0140

Land Pattern Number

90-0013

Thermal Resistance, Single Layer Board:

47

1.7

Thermal Resistance, Four Layer Board:

29

1.7

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

www.maximintegrated.com

Maxim Integrated │ 7

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