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ST25DV64KC Scheda tecnica(PDF) 158 Page - STMicroelectronics

Il numero della parte ST25DV64KC
Spiegazioni elettronici  Dynamic NFC/RFID tag IC with 4-Kbit, 16-Kbit or 64-Kbit EEPROM, fast transfer mode capability and optimized I2C
PDF  203 Pages
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Produttore elettronici  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST25DV64KC Scheda tecnica(HTML) 158 Page - STMicroelectronics

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10.4
WLCSP10 package information
Figure 89. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale package outline
X
A3
A2
A
bbb Z
e
I
H
e1
D
G
DETAIL A
Orientation reference
Y
E
aaa
(4X)
SIDE VIEW
BOTTOM VIEW
TOP VIEW
DETAIL A
ROTATED 90
ccc M Z X Y
dddM Z
Z
A1
b(10x)
eee Z
SEATING PLANE
BUMP
J
F
1.
Drawing is not to scale.
2.
Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3.
Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4.
Bump position designation per JESD 95-1, SPP-010.
Table 262. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale mechanical data
Symbol
millimeters
inches (1)
Min
Typ
Max
Min
Typ
Max
A
0.265
0.295
0.325
0.0104
0.0116
0.0128
A1
-
0.095
-
-
0.0037
-
A2
-
0.175
-
-
0.0069
-
A3
-
0.025
-
-
0.0010
-
b
-
0.185
-
-
0.0073
-
D
-
1.649
1.669
-
0.0649
0.0657
E
-
1.483
1.503
-
0.0584
0.0592
e
-
0.400
-
-
0.0157
-
e1
-
0.800
-
-
0.0315
-
H
-
0.346
-
-
0.0136
-
I
-
1.039
-
-
0.0409
-
ST25DV04KC ST25DV16KC ST25DV64KC
WLCSP10 package information
DS13519 - Rev 3
page 158/203



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