6.4 Thermal Information: OPA387

THERMAL METRIC(1)

OPA387

UNIT

DBV (SOT-23)

5 PINS

Junction-to-ambient thermal resistance

187.1

°C/W

Junction-to-case(top) thermal resistance

107.4

°C/W

Junction-to-board thermal resistance

57.5

°C/W

Junction-to-top characterization parameter

33.5

°C/W

Junction-to-board characterization parameter

57.1

°C/W

Junction-to-case(bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2387

THERMAL METRIC(1)

OPA2387

UNIT

DGK (VSSOP)

DSG (WSON)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

165

71.9

°C/W

Junction-to-case (top) thermal resistance

53

88.8

°C/W

Junction-to-board thermal resistance

87

39.3

°C/W

Junction-to-top characterization parameter

4.9

3.2

°C/W

Junction-to-board characterization parameter

85

39.2

°C/W

Junction-to-case (bottom) thermal resistance

N/A

14.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

Thermal Information: OPA4387

THERMAL METRIC(1)

OPA4387

UNIT

PW (TSSOP)

14 PINS

Junction-to-ambient thermal resistance

109.6

°C/W

Junction-to-case (top) thermal resistance

27.4

°C/W

Junction-to-board thermal resistance

56.1

°C/W

Junction-to-top characterization parameter

1.5

°C/W

Junction-to-board characterization parameter

54.9

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA387, OPA2387, OPA4387

SBOS984F – NOVEMBER 2020 – REVISED FEBRUARY 2022

www.ti.com

6

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: OPA387 OPA2387 OPA4387