MIC5376 datasheet(11/24 Pages) MICROCHIP

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

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DS20006080B-page 11

MIC5376/7/8

EQUATION 4-2:

To determine the maximum ambient operating

temperature

the

package,

use

the

junction-to-ambient thermal resistance of the device

and the following basic equation:

EQUATION 4-3:

The maximum junction temperature of the device is

+125°C. The thermal resistance is 250°C/W for the

UDFN/TQFN packages and 256.5°C/W for the

SC-70-5.

Substituting PD for PD(MAX) and solving for the ambient

operating temperature will give the maximum operating

conditions

for

the

regulator

circuit.

The

junction-to-ambient thermal resistance for the

minimum footprint is 250°C/W.

The maximum power dissipation must not be exceeded

for proper operation.

For example, when operating the MIC5376-2.8YMT at

an input voltage of 3.6V and 150 mA load with a

minimum footprint layout, the maximum ambient

operating temperature (TA) can be determined as

follows:

EQUATION 4-4:

Therefore, a maximum ambient operating temperature

of +95°C is allowed for a 1 mm x 1 mm UDFN package.

For a full discussion of heat sinking and thermal effects

on voltage regulators, refer to the “Regulator Thermals”

section of Microchip’s Designing with Low-Dropout

Voltage Regulators handbook.

3.6V 2.8V

–





150mA



0.12W

PD MAX





TJ MAX





–

JA

--------------------------------

0.12W

125C TA

–





250C/W



TA 95C

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