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DS20006080B-page 14

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2018 - 2022 Microchip Technology Inc. and its subsidiaries

4-Lead 1 mm x 1 mm UDFN Package Outline and Recommended Land Pattern

B

A

0.05 C

0.05 C

0.10

C A B

0.05

C

(DATUM B)

(DATUM A)

C

SEATING

PLANE

NOTE 1

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 1

0.05

C A B

0.05

C A B

0.05 C

0.08 C

Microchip Technology Drawing C04-1149 Rev A Sheet 1 of 2

2X

4X

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

4-Lead Ultra Thin Plastic Dual Flat, No Lead Package (HCA) - 1x1 mm Body [UDFN]

D

E

e

4X b

L

E2

D2

(A3)

A

A1

12

3

4

12

3

N=4