MIC5376/7/8

DS20006080B-page 16

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2018 - 2022 Microchip Technology Inc. and its subsidiaries

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Center Pad Width

Center Pad Length

Contact Pitch

Y2

X2

0.48

0.48

MILLIMETERS

0.65 BSC

MIN

E

MAX

Contact Pad Length (X3)

Contact Pad Width (X4)

Y1

X1

0.40

0.25

NOM

12

4

C0

9

.

0

g

n

i

c

a

p

S

d

a

P

t

c

a

t

n

o

C

Thermal Via Diameter

V

0.30

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

E

C

X1

Y1

2X CH

Y2

X2

ØV

SILK SCREEN

3

Contact Pad Chamfer (X3)

CH

0.18

Y3 0.47

7

4

.

0

3

Y

h

t

g

n

e

L

d

a

P

1

l

a

n

i

m

r

e

T

45°

Microchip Technology Drawing C04-3149 Rev A

4-Lead Ultra Thin Plastic Dual Flat, No Lead Package (HCA) - 1x1 mm Body [UDFN]