Data Sheet

ADPA7002

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 5 of 20

Table 5.

Parameter

Rating

VDDX

6.0 V

VGG1

−1.6 V to 0 V

RF Input Power (RFIN)

25 dBm

Continuous Power Dissipation (PDISS), TA = 85°C

(Derate 69 mW/°C above 85°C)

6.21 W

Temperature

Storage Range

−65°C to +150°C

Operating Range

−40°C to +85°C

Nominal Junction (TA = 85°C, VDD = 5 V, IDQ =

700 mA)

135.75°C

Maximum Channel Temperature

175°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

Class 0A (passed 125 V)

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

Table 6. Thermal Resistance

Package Type

θJC

Unit

EH-16-11

14.5

°C/W

1 Thermal resistance (θJC) is determined by simulation under the following

conditions: the heat transfer is due solely to thermal conduction from the

channel, through the ground paddle, to the PCB, and the ground paddle is held

constant at the operating temperature of 85°C.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.