Motore di ricerca datesheet componenti elettronici
  Italian  ▼
ALLDATASHEETIT.COM

X  

FS2302M Scheda tecnica(PDF) 3 Page - NXP Semiconductors

Il numero della parte FS2302M
Spiegazioni elettronici  Safety system basis chip (SBC) with power management, CAN FD and LIN transceivers
PDF  230 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Produttore elettronici  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
Logo NXP - NXP Semiconductors

FS2302M Scheda tecnica(HTML) 3 Page - NXP Semiconductors

  FS2302M Datasheet HTML 1Page - NXP Semiconductors FS2302M Datasheet HTML 2Page - NXP Semiconductors FS2302M Datasheet HTML 3Page - NXP Semiconductors FS2302M Datasheet HTML 4Page - NXP Semiconductors FS2302M Datasheet HTML 5Page - NXP Semiconductors FS2302M Datasheet HTML 6Page - NXP Semiconductors FS2302M Datasheet HTML 7Page - NXP Semiconductors FS2302M Datasheet HTML 8Page - NXP Semiconductors FS2302M Datasheet HTML 9Page - NXP Semiconductors Next Button
Zoom Inzoom in Zoom Outzoom out
 3 / 230 page
background image
NXP Semiconductors
FS23
Safety system basis chip (SBC) with power management, CAN FD and LIN transceivers
2 Features and benefits
Operating modes
• Normal mode with all power management and functional safety features available
• Stop mode: Low-power OFF mode with multiple wake-up sources (LPOFF)
• Standby mode: Low-power ON mode with HVBUCK or HVLDO1 active and multiple wake-up sources (LPON)
Power management
• HVBUCK: Synchronous buck converter with integrated FETs. Configurable Normal mode output voltage and LPON mode output voltage
(3.3 V or 5.5 V). Output DC current capability of 600 mA in Normal mode, and 100 mA current capability in Low-power ON mode
• HVLDO1: High-voltage LDO instead of the HVBUCK for MCU supply with selectable output voltage (3.3 V or 5.5 V) and up to 100 mA
DC current capability with internal PMOS and 250 mA with external PNP
• HVLDO2: High-voltage LDO regulator for system loads, with optional external protection for off-board sensors, selectable output voltage
(3.3 V or 5.0 V) and up to 100 mA DC current capability
• HVLDO3: High-voltage LDO regulator for CAN FD block supply or other with selectable output voltage (3.3 V or 5.0 V) and up to 150
mA current capability
System features
• One CAN FD supporting up to 5 Mbps communication following ISO 11898-2:2016 and SAE J2284 standards
• One LIN following LIN 2.2, ISO 17987-4 and SAE-J2602-2 standards
• Two wake-up inputs (40 V capable)
• Two high-voltage I/Os with wake-up capability (40 V capable)
• Up to four low-voltage I/Os with wake-up capability
• Four configurable high-side drivers with 150 mA drive capability, to supply LEDs or enable external devices (INH), and cyclic-sense
capability
• Multiple wake-up sources: WAKE pins, HVIO pins, LVIO pins, CAN FD, LIN or dedicated SPI / I2C command
• Device control via 32 bits SPI interface or via I2C interface, with CRC
• Integrated long duration timer (LDT) for system shutdown and wake-up control, programmable up to 194 days
• 16-channel analog multiplexer (AMUX) for system monitoring (temperature, battery voltage, internal voltages)
Functional safety
• Developed following ISO 26262:2018 standard to fit for ASIL B applications
• Internal monitoring circuitry with its own reference
• Additional input for external voltage monitoring
• Window or timeout watchdog function to monitor the MCU failures by software
• FCCU inputs to monitor MCU failures by hardware
• Analog built-in self-test (ABIST) on demand
• Safety outputs (RSTB, FS0B, LIMP0 and LIMP1/2 with 1.25 Hz or 100 Hz PWM capability)
EMC compliance
• The FS23 EMC tests are performed according to ZVEI Generic IC EMC Test Specification version 2.1 (2017) and FMC1278
Electromagnetic Compatibility Specification for Electrical/Electronic Components and subsystems version 3.0 (2018).
• CAN EMC performances certified against IEC62228-3:2019 and SAE J2962-2:2019
• LIN EMC performances certified against IEC62228-2:2016 and SAE J2962-1:2019
Configuration and enablement
• QFN48EP: QFN 48 pins with exposed pad for optimized thermal management, wettable flanks, 7 x 7 x 0.85 mm, 0.5 mm pitch, 48 pins
• One-time programmable (OTP) memory for scalability, expandability and device customization
• OTP emulation mode for system development and evaluation
FS23
All information provided in this document is subject to legal disclaimers.
© 2024 NXP B.V. All rights reserved.
Product data sheet
Rev. 7.0 — 16 October 2024
Document feedback
3 / 230



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


Scheda tecnica Scarica

Go To PDF Page


Link URL



Lei ha avuto il aiuto da alldatasheet?  [ DONATE ] 

Di alldatasheet   |   Richest di pubblicita   |   contatti   |   Privacy Policy   |   Collegamento alla scheda tecnica    |   scambio Link   |   Ricerca produttore
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com