PACKAGE OUTLINE

4230162/A 11/2023

www.ti.com

QFN-FCMOD - 2.00 mm max height

PLASTIC QUAD FLAT PACK- NO LEAD

VCD0009A

A

0.08 C

SEATING PLANE

PIN 1 INDEX AREA

C

B

NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

2.7

2.5

2.6

2.4

2

1.9

0.05

0

(0.2) TYP

1

3

7

8

6

2X 1.05

0.85

1.28

1.08

0.1

C A B

0.05

C

PIN1 ID

7X 0.35

0.15

2X 0.5

0.3

0.78

0.58

2X (0.12)

2X 1

2X 0.5

2X 0.075

2X 0.475

2X 1

0.65±0.1

4X (0.125)

2

18X (0.18)

0.36±0.1

2X 0.74±0.1

9

0.65

0.45

0.135

0.000

0.3

0.2