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XTPSM81033VCDR Scheda tecnica(PDF) 18 Page - Texas Instruments

Il numero della parte XTPSM81033VCDR
Spiegazioni elettronici  TPSM81033 5.5V, 2A, 2.4MHz, Synchronous Boost Power Module with MagPack™ Packaging Technology, Power Good Indicator and Output Discharge Function
PDF  31 Pages
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
Logo TI - Texas Instruments

XTPSM81033VCDR Scheda tecnica(HTML) 18 Page - Texas Instruments

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VIN = 3.3V, VOUT = 5V, IOUT = 1A
Figure 7-11. Output Short Protection (Entry)
VIN = 3.3V, VOUT = 5V, IOUT = 1A
Figure 7-12. Output Short Protection (Recover)
7.3 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 1.8V to 5.5V. This input supply
must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk
capacitance may be required in addition to the ceramic bypass capacitors. A typical choice is a tantalum or
aluminum electrolytic capacitor with a value of 100µF. Output current of the input power supply must be rated
according to the supply voltage, output voltage, and output current of the TPSM81033.
7.4 Layout
7.4.1 Layout Guidelines
As for all switching power supplies, especially those running at high switching frequency and high currents,
layout is an important design step. If the layout is not carefully done, the regulator suffers from instability and
noise problems. To maximize efficiency, switch rise and fall time are very fast. To prevent radiation of high
frequency noise (for example, EMI), proper layout of the high-frequency switching path is essential. The input
capacitor needs not only to be close to the VIN pin, but also to the GND pin in order to reduce input supply
ripple.
The most critical current path for all boost converters is from the switching FET, through the rectifier FET, then
the output capacitors, and back to ground of the switching FET. This high current path contains nanosecond rise
and fall time and must be kept as short as possible. Therefore, the output capacitor not only must be close to the
VOUT pin, but also to the GND pin to reduce the overshoot at the VOUT pin.
For better thermal performance, TI suggest to make copper polygon connected with each pin bigger.
TPSM81033
SLVSHL0D – JUNE 2024 – REVISED DECEMBER 2024
www.ti.com
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