EXAMPLE BOARD LAYOUT

4230162/A 11/2023

www.ti.com

QFN-FCMOD - 2.00 mm max height

VCD0009A

PLASTIC QUAD FLAT PACK- NO LEAD

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 25X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271)

.

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK DETAILS

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

METAL

SOLDER MASK

OPENING

EXPOSED METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

EXPOSED

METAL

NON- SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

1

3

(R0.05) TYP

(1.15)

2X (1)

2X (0.475)

2X (0.42)

2X (0.075)

2X (0.5)

2X (0.713)

2X (1)

0.000 PKG ℄

(0.983)

18X (0.25)

2X (0.875)

2X (0.574)

2X (0.6)

2X (1.15)

(0.875)

(1.375)

5X (0.325)

(Ø0.2) VIA

TYP

2

6

7

8

9

(0.135)

2X (0.94)

(0.55)

(0.25)

(0.36)