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LM5111 Scheda tecnica(PDF) 21 Page - Texas Instruments

Il numero della parte LM5111
Spiegazioni elettronici  LM5111 Dual 5-A Compound Gate Driver
PDF  30 Pages
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Produttore elettronici  TI2 [Texas Instruments]
Homepage  https://www.ti.com
Logo TI2 - Texas Instruments

LM5111 Scheda tecnica(HTML) 21 Page - Texas Instruments

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PACKAGE MATERIALS INFORMATION
www.ti.com
23-May-2025
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0
P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1
Q1
Q2
Q2
Q3
Q3
Q4
Q4
User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM5111-1MX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5111-1MY/NOPB
HVSSOP
DGN
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM5111-1MYX/NOPB
HVSSOP
DGN
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM5111-2MX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5111-2MY/NOPB
HVSSOP
DGN
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM5111-2MYX/NOPB
HVSSOP
DGN
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM5111-3MX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5111-4MX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM5111-4MY/NOPB
HVSSOP
DGN
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1



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