LMH6580, LMH6581

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SNOSAY4C – AUGUST 2007 – REVISED MAY 2013

ABSOLUTE MAXIMUM RATINGS

(1) (2)

ESD Tolerance(3)

Human Body Model

2000V

Machine Model

200V

VS

±6V

IIN (Input Pins)

±20 mA

IOUT

See(4)

Input Voltage Range

V− to V+

Maximum Junction Temperature

+150°C

Storage Temperature Range

−65°C to +150°C

Soldering Information

Infrared or Convection (20 sec.)

235°C

Wave Soldering (10 sec.)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see ±3.3V Electrical

Characteristics and ±5V Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum output current (IOUT) is determined by device power dissipation limitations. The maximum power dissipation is a function

of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for

packages soldered directly onto a PC Board.

OPERATING RATINGS

(1)

Temperature Range(2)

−40°C to +85°C

Supply Voltage Range

±3V to ±5.5V

Thermal Resistance 48-Pin TQFP

θJA

44°C/W

θJC

12°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see ±3.3V Electrical

Characteristics and ±5V Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

±3.3V ELECTRICAL CHARACTERISTICS

(1)

Unless otherwise specified, typical conditions are: TA = 25°C, AV = +2, VS = ±3.3V, RL = 100Ω; Boldface limits apply at the

temperature extremes.

Symbol

Parameter

Conditions

Min(2)

Typ(3)

Max(2)

Units

Frequency Domain Performance

SSBW

−3 dB Bandwidth

VOUT = 0.5 VPP

425

LSBW

LMH6580 VOUT = 1 VPP,

500

LMH6581 V OUT = 2 VPP, RL = 1 kΩ

MHz

LMH6580 VOUT = 1 VPP,

450

LMH6581 VOUT = 2 VPP, RL = 150Ω

GF

0.1 dB Gain Flatness

LMH6580 VOUT = 1 VPP,

70

MHz

LMH6581 V OUT = 2 VPP, RL = 150Ω

Time Domain Response

tr

Rise Time

LMH6580 1V Step, LMH6581

3.1

ns

2V Step, 10% to 90%

tf

Fall Time

LMH6580 1V Step, LMH6581

1.4

ns

2V Step, 10% to 90%

(1)

Electrical Table values apply only for factory testing conditions at the temperature indicated. No ensured parametric performance is

indicated in the electrical tables under conditions different than those tested.

(2)

Room Temperature limits are 100% production tested at 25°C. Factory testing conditions result in very limited self-heating of the device

such that TJ = TA. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC)

methods.

(3)

Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped

production material.

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