AD9744 datasheet(31/32 Pages) AD

31 / 32 page

AD9744

Rev. B | Page 31 of 32

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.45

3.30 SQ

3.15

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

Figure 60. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body (CP-32-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Options

AD9744AR

−40°C to +85°C

28-Lead, 300-Mil SOIC

RW-28

AD9744ARRL

−40°C to +85°C

28-Lead, 300-Mil SOIC

RW-28

AD9744ARZ1

−40°C to +85°C

28-Lead, 300-Mil SOIC

RW-28

AD9744ARZRL1

−40°C to +85°C

28-Lead, 300-Mil SOIC

RW-28

AD9744ARU

−40°C to +85°C

28-Lead TSSOP

RU-28

AD9744ARURL7

−40°C to +85°C

28-Lead TSSOP

RU-28

AD9744ARUZ1

−40°C to +85°C

28-Lead TSSOP

RU-28

AD9744ARUZRL71

−40°C to +85°C

28-Lead TSSOP

RU-28

AD9744ACP

−40°C to +85°C

32-Lead LFCSP

CP-32-3

AD9744ACPRL7

−40°C to +85°C

32-Lead LFCSP

CP-32-3

AD9744ACPZ1

−40°C to +85°C

32-Lead LFCSP

CP-32-3

AD9744ACPZRL71

−40°C to +85°C

32-Lead LFCSP

CP-32-3

AD9744-EB

Evaluation Board (SOIC)

AD9744ACP-PCB

Evaluation Board (LFCSP)

1 Z = Pb-free part.

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