MSC045SMB120SD

Package Specification

 Data Sheet

© 2025 Microchip Technology Inc. and its subsidiaries

DS50004035A - 10

Table 2-1. TO-263-7L XL Dimensions (continued)

Symbol

Description

Min. (mm)

Max. (mm)

A

Overall height

4.30

4.70

A1

Seating plane height

—

0.25

A2

Seating plane to lead

2.20

2.60

b

Lead width

0.52

0.72

b1

0.60

0.80

c

Lead thickness

0.42

0.62

c2

Thermal pad thickness

1.07

1.47

L

Lead length

4.55

4.95

L1

Tab length

0.87

1.27

L2

Foot length

2.48

2.88

D

Molded body length

9.05

9.45

D1

Thermal pad length

7.58

7.98

E

Total width

9.80

10.20

E1

Thermal pad width step back

6.30

6.70

E2

Thermal pad width

7.80

8.20

Ø

Lead foot angle

0°

8°

Note: Dimensioning and tolerancing per ASME Y14.5M.

• BSC: Basic dimension. Theoretically exact value shown without tolerances.

2.2.

Recommended Land Pattern

The following figure illustrates the recommended land pattern of this device.

Figure 2-2. Recommended Land Pattern

12

C1

C2

X2

Y2

G1

Y1

X1

G2

E

34 5 6

7

SILK SCREEN

The following table shows the recommended land pattern dimensions.