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FN8724 Scheda tecnica(PDF) 33 Page - Renesas Technology Corp |
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FN8724 Scheda tecnica(HTML) 33 Page - Renesas Technology Corp |
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33 / 34 page ![]() ISL98608IIH FN8724 Rev.2.01 Page 33 of 33 Dec 7, 2021 Package Outline Drawing For the most recent package outline drawing, see W4x4.16G. W4x4.16G 16 BALL WLCSP WITH 0.4mm PITCH 4x4 ARRAY (1.740mm x 1.740mm) Rev 1, 9/16 TYPICAL RECOMMENDED LAND PATTERN TOP VIEW SIDE VIEW 1.740 ±0.030 1.740 ±0.030 X Y (4X) 0.10 PIN 1 (A1 CORNER) BOTTOM VIEW 0.400 0.270 0.270 0.200 16X0.265 ±0.035 1 A PACKAGE OUTLINE 0.215 0.265 0.400 SEATING PLANE 3 0.10 Z X Y 0.05 Z 0.265 ±0.035 0.05 Z Z 0.200 ±0.030 0.50 ±0.050 B C D 23 4 4 5 NOTES: 11. All dimensions are in millimeters. 12. Dimensions and tolerances per ASMEY 14.5-1994. 13. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 14. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 15. Bump position designation per JESD 95-1, SPP-010. 16. NSMD refers to non-solder mask defined pad design per techbrief, TB451. 6 NSMD |
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