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ADMV4530 Scheda tecnica(PDF) 8 Page - Analog Devices |
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ADMV4530 Scheda tecnica(HTML) 8 Page - Analog Devices |
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8 / 64 page ![]() Data Sheet ADMV4530 ABSOLUTE MAXIMUM RATINGS analog.com Rev. C | 8 of 64 Figure 2. Circuit Level Description of Power Map (Left) and Uniform Power Dissipation Methods (Right) Table 5. Thermal Rise from Case to Junction Operational Mode ΔTJC Unit IF and I/Q mode 32 °C The thermal resistance of the ADMV4530 assuming the JE- DEC standard of uniform power dissipation based on a JEDEC (JESD51-2) board is shown in Table 6. Thermal resistance based on a uniform power dissipation is useful to compare the perform- ance of the ADMV4530 to other similar ICs. Table 6. Thermal Resistance Package Type θJC_BOT1 θJC_TOP1 ΨJT ΨJB θJA Unit CC-40-8 3.9 11.7 3.0 8.5 28.2 °C/W 1 See JEDEC Standard JESD51-2 for additional information on optimizing the thermal impedance. ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devi- ces and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. |
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