Ordering Information

MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 0

Freescale Semiconductor

41

3.5

Thermal Considerations

Eqn. 1

where

R

The power dissipation values for the MSC8113 are listed in Table 2-3. The ambient temperature for the device is the air

temperature in the immediate vicinity that would cool the device. The junction-to-ambient thermal resistances are JEDEC

standard values that provide a quick and easy estimation of thermal performance. There are two values in common usage: the

value determined on a single layer board and the value obtained on a board with two planes. The value that more closely

approximates a specific application depends on the power dissipated by other components on the printed circuit board (PCB).

The value obtained using a single layer board is appropriate for tightly packed PCB configurations. The value obtained using a

board with internal planes is more appropriate for boards with low power dissipation (less than 0.02 W/cm

convection) and well separated components. Based on an estimation of junction temperature using this technique, determine

whether a more detailed thermal analysis is required. Standard thermal management techniques can be used to maintain the

the power dissipation of the chip. You can verify the junction temperature by measuring the case temperature using a small

diameter thermocouple (40 gauge is recommended) or an infrared temperature sensor on a spot on the device case that is painted

black. The MSC8113 device case surface is too shiny (low emissivity) to yield an accurate infrared temperature measurement.

Eqn. 2

where

θ

Note:

See MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines (AN2601/D).

4

Ordering Information

Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.

Part

Package Type

Core

Voltage

Operating

Temperature

Core

Frequency

(MHz)

Order Number

Lead-Free

Lead-Bearing

MSC8113

Flip Chip Plastic Ball Grid Array (FC-PBGA)

1.1 V

–40° to 105°C

300

MSC8113TVT3600V

MSC8113TMP3600V

400

MSC8113TVT4800V

MSC8113TMP4800V