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TDA7500 Scheda tecnica(PDF) 10 Page - STMicroelectronics |
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TDA7500 Scheda tecnica(HTML) 10 Page - STMicroelectronics |
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10 / 14 page ![]() Bit PRAM Address, PABx(15:0) is generated by the Program Address Generator of the DSP core for Instruction Fetching, and by the AGU in the case of the Move Program Memory (MOVEM) In- struction. The 24-Bit PRAM Data (Program Code), PDBx(23:0), can only be written to using the MOVEM instruction. During instruction fetch- ing the PDBx Bus is routed to the Program De- code Controller of the DSP core for instruction decoding. 256 x 24-Bit Bootstrap ROM (PROM) This is a 256 x 24-Bit factory programmed Boot ROM used for storing the program sequence and for initial- izing the DSP. Essentially this consists of reading the data via I 2C, SPI or EMI interface and store it in PRAM, XRAM, YRAM, and/or external DRAM. Serial Audio Interface (SAI) The SAI is used to deliver digital audio to the DSPs from an external source. Once processed by the DSPs, it can be returned through this inter- face either sent to the DAC for D/A conversion. The features of the SAI are listed below. 3 Synchronized Stereo Data Transmission Lines 3 Synchronized Stereo Data Reception Lines Master and Slave operating mode: clock lines can be both master and slave. Receive and Transmit Data Registers have two locations to hold left and right data. XCHG Interface (DSP to DSP Exchange Inter- face) The Exchange Interface peripheral provides bidi- rectional communication between DSP0 and DSP1. Both 24 bit word data and four bit Flag data can be exchanged. A FIFO is utilized for re- ceived data. It minimizes the number of times an Exchange Interrupt Service Routine would have to be called if multi-word blocks of data were to be received. The Transmit FIFO is in effect the Receive FIFO of the other DSP and is written di- rectly by the transmitting DSP. The features of the XCHG are listed below. 10 Word XCHG Receive FIFO on both DSPs Four Flags for each XCHG for DSP to DSP signaling Condition flags can optionally trigger interrupts on both DSPs DRAM/SRAM Interface (EMI) The External DRAM/SRAM Interface is viewed as a memory mapped peripheral. Data transfers are performed by moving data into/from data regis- ters and the control is exercised by polling status flags in the control/status register or by servicing interrupts. An external memory write is executed by writing data into the EMI Data Write Register. An external memory read operation is executed by either writing to the offset register or reading the EMI Data Read Register, depending on the configuration. The features of the EMI are listed below. Data bus width fixed at 4 bits for DRAM and 8 bits for SRAM. Data word length 16 or 24 bits for DRAM. Data word length 8or 16 or 24 bits for SRAM. Thirteen DRAM address lines means 2 26 = 32MB addressable DRAM. Refresh rate for DRAM can be chosen among eight divider factor. SRAM relative addressing mode; 2 22 = 4MB addressable SRAM. Four SRAM Timing choices. Two Read Offset Registers. Debug Interface A dedicated Debug Port is available for each DSP Cores. The debug logic is contained in the core design of the DSP. The features of the Debug Port are listed below: Breakpoint Logic Trace Logic Single stepping Instruction Injection Program Disassembly Serial Peripheral Interface The DSP core requires a serial interface to re- ceive commands and data over the LAN. During an SPI transfer, data is transmitted and received simultaneously. A serial clock line synchronizes shifting and sampling of the information on the two serial data lines. A slave select line allows in- dividual selection of a slave SPI device. When an SPI transfer occurs an 8-bit word is shifted out one data pin while another 8-bit char- acter is simultaneously shifted in a second data pin. The central element in the SPI system is the shift register and the read data buffer. The system is single buffered in the transfer direction and dou- ble buffered in the receive direction. I 2C Interface The inter Integrated Circuit bus is a single bidirec- tional two-wire bus used for efficient inter IC con- trol. All I 2C bus compatible devices incorporate an on-chip interface which allows them communi- cate directly with each other via the I 2C bus. TDA7500 10/14 |
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