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MPC8378E Scheda tecnica(PDF) 113 Page - Freescale Semiconductor, Inc |
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MPC8378E Scheda tecnica(HTML) 113 Page - Freescale Semiconductor, Inc |
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113 / 126 page  MPC8378E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 113 Thermal 23 Thermal This section describes the thermal specifications of the MPC8378E. 23.1 Thermal Characteristics Table 76 provides the package thermal characteristics for the 689 31 × 31mm TePBGA II package. 48.0 0 1 2 3 576 144 288 72 6 36 18 — — — 360 432 66.7 0 1 2 2 533 133 266 66.7 33.3 16.7 — — — 333 400 25.0 0 0 4 8 800 200 200 100 6 50 25 — — 400 500 600 33.3 0 0 2 8 533 266.7 267 133 6 66.7 33.3 — 400 533 667 800 50.0 0 0 4 4 800 200 200 100 6 50 25 — — 400 500 600 50.0 0 0 2 8 800 400 400 5 — 100 6 50 — 600 800 — — 66.7 0 0 2 4 533 266.7 267 133 6 66.7 33.3 — 400 533 667 800 66.7 0 0 2 5 667 333 333 — 83.3 6 41.6 333 500 667 — — 66.7 0 0 2 6 800 400 400 5 — 100 6 50 400 600 800 — — Note: 1 Values in MHz. 2 System PLL VCO range: 400–800 MHz. 3 CSB frequencies less than 133 MHz will not support Gigabit Ethernet rates. 4 Minimum data rate for DDR2 is 250 MHz and for DDR1 is 167 MHz. 5 Applies to DDR2 only. 6 Applies to eLBC PLL-enabled mode only. Table 76. Package Thermal Characteristics for TePBGA II Parameter Symbol Value Unit Notes Junction-to-ambient natural convection on single layer board (1s) RθJA 21 °C/W 1, 2 Junction-to-ambient natural convection on four layer board (2s2p) RθJA 15 °C/W 1, 2, 3 Junction-to-ambient (at 200 ft/min) on single layer board (1s) RθJMA 16 °C/W 1, 3 Junction-to-ambient (at 200 ft/min) on four layer board (2s2p) RθJMA 12 °C/W 1, 3 Junction-to-board thermal RθJB 8 °C/W 4 Junction-to-case thermal RθJC 6 °C/W 5 Table 75. Example Clock Frequency Combinations (continued) eLBC 1 e300 Core 1 Ref 1 LBCM DDRCM SVCOD SPMF Sys VCO1,2 CSB 1,3 DDR data rate1,4 /2 /4 /8 × 1 × 1.5 × 2 × 2.5 × 3 |
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