MPC8378E datasheet(119/126 Pages) FREESCALE

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MPC8378E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2

Freescale Semiconductor

119

System Design Information

RθJC = junction to case thermal resistance (°C/W)

PD = power dissipation (W)

24 System Design Information

This section provides electrical and thermal design recommendations for successful application of the

MPC8378E.

24.1

PLL Power Supply Filtering

Each of the PLLs listed above is provided with power through independent power supply pins. The AVDD

level should always be equivalent to VDD, and preferably these voltages will be derived directly from VDD

through a low frequency filter scheme.

There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to

provide five independent filter circuits as illustrated in Figure 68, one to each of the five AVDD pins. By

providing independent filters to each PLL, the opportunity to cause noise injection from one PLL to the

other is reduced.

This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz

range. It should be built with surface mount capacitors with minimum Effective Series Inductance (ESL).

Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook

of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a

single large value capacitor.

Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize

noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AVDD

pin, which is on the periphery of package, without the inductance of vias.

Figure 68 shows the PLL power supply filter circuit.

Figure 68. PLL Power Supply Filter Circuit

24.2

Decoupling Recommendations

Due to large address and data buses, and high operating frequencies, the device can generate transient

power surges and high frequency noise in its power supply, especially while driving large capacitive loads.

This noise must be prevented from reaching other components in the device system, and the device itself

requires a clean, tightly regulated source of power. Therefore, it is recommended that the system designer

place at least one decoupling capacitor at each VDD, OVDD, GVDD, and LVDD pins of the device. These

decoupling capacitors should receive their power from separate VDD, OVDD, GVDD, LVDD, and GND

power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may be placed directly

under the device using a standard escape pattern. Others may surround the part.

VDD

AVDD (or L2AVDD)

2.2 µF

GND

Low ESL Surface Mount Capacitors

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