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SSM2804CBZ-R7 Scheda tecnica(PDF) 36 Page - Analog Devices |
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SSM2804CBZ-R7 Scheda tecnica(HTML) 36 Page - Analog Devices |
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36 / 36 page ![]() SSM2804 Rev. 0 | Page 36 of 36 OUTLINE DIMENSIONS A B C D E 0.660 0.600 0.540 3.000 2.960 2.920 1 2 3 4 5 6 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) SIDE VIEW 0.270 0.240 0.210 0.390 0.360 0.330 0.360 0.320 0.280 2.00 REF 2.50 REF BALL A1 IDENTIFIER COPLANARITY 0.05 SEATING PLANE 2.500 2.460 2.420 0.50 BALL PITCH Figure 40. 30-Ball Wafer Level Chip Scale Package [WLCSP] (CB-30-4) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option SSM2804CBZ-RL −40°C to +85°C 30-Ball Wafer Level Chip Scale Package [WLCSP] CB-30-4 SSM2804CBZ-R7 −40°C to +85°C 30-Ball Wafer Level Chip Scale Package [WLCSP] CB-30-4 EVAL-SSM2804Z Evaluation Board 1 Z = RoHS Compliant Part. I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors). ©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09960-0-7/11(0) |
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