CXP83508 datasheet(29/30 Pages) SONY

Il numero della parte	CXP83508

Spiegazioni elettronici	CMOS 8-bit Single Chip Microcomputer

PDF	30 Pages

Scroll/Zoom	100%

Produttore elettronici	SONY [Sony Corporation]

Homepage	http://www.sony.co.jp

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29 / 30 page

CXP83508/83512/83516, CXP83509/83513/83517

– 29 –

PACKAGE STRUCTURE

SONY CODE

EIAJ CODE

JEDEC CODE

QFP-80P-L01

QFP080-P-1420

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

42/COPPER ALLOY

1.6g

23.9 ± 0.4

20.0 – 0.1

+ 0.4

0.8

0.35 – 0.1

+ 0.15

0.1 – 0.05

+ 0.2

2.75 – 0.15

+ 0.35

0.15 – 0.05

+ 0.1

80PIN QFP (PLASTIC)

0.2

0.15

0° to 10°

DETAIL A

Package Outline

Unit: mm

CXP83508/83512/83516

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

42 ALLOY

PACKAGE STRUCTURE

14.0 ± 0.2

∗

12.0 ± 0.1

(0.22)

0.18 – 0.03

+ 0.08

1.5 – 0.1

+ 0.2

0.127 – 0.02

+ 0.05

0.1 ± 0.1

0° to 10°

DETAIL A

80PIN LQFP (PLASTIC)

0.5g

LQFP-80P-L01

LQFP080-P-1212

0.1

NOTE: Dimension “

∗” does not include mold protrusion.

0.13 M

0.5

CXP83508/83512/83516

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