IR21141SS datasheet(2/34 Pages) IRF

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IR21141/IR22141SSPbF

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Recommended Operating Conditions

For proper operation the device should be used within the recommended conditions. All voltage parameters are absolute

voltages referenced to VSS. The VS offset rating is tested with all supplies biased at a 15 V differential.

Symbol

Definition

Min.

Max.

Units

High side floating supply voltage

†

VS + 11.5

VS + 20

IR21141

VSS

600

High side floating supply offset voltage

††

IR22141

VSS

1200

VHO

High side output voltage (HOP, HON and SSDH)

VS + 20

VLO

Low side output voltage (LOP, LON and SSDL)

VCOM

VCC

Low side and logic fixed supply voltage (Note 1)

11.5

COM

Power ground

-5

VIN

Logic input voltage (HIN, LIN and FLT_CLR)

VSS

VCC

VFLT

Fault input/output voltage (FAULT/SD and SY_FLT)

VSS

VCC

VDSH

High side DS pin input voltage

VS - 2.0

VDSL

Low side DS pin input voltage

VCOM - 2.0

VCC

tPWHIN

High side pulse width for HIN input

µs

Ambient temperature

-40

125

°C

†

While internal circuitry is operational below the indicated supply voltages, the UV lockout disables the output

drivers if the UV thresholds are not reached. A minimum supply voltage of 8V is recommended for the driver

to operate safely under switching conditions at VS pin (please refer to the “start-up sequence” in application

section of this document)

††

Logic operational for VS from VSS-5 V to VSS +600 V or 1200 V. Logic state held for VS from VSS -5 V to VSS-

VBS. For a negative spike on VB (referenced to VSS) of less than 200ns the IC will withstand a sustained peak

of -40V under normal operation and an isolated event of up to -70V peak spike (please refer to the Design

Tip DT97-3 for more details).

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage

parameters are absolute voltages referenced to VSS, all currents are defined positive into any lead The thermal resistance

and power dissipation ratings are measured under board mounted and still air conditions.

Symbol

Definition

Min.

Max.

Units

High side offset voltage

VB - 25

VB + 0.3

IR21141

-0.3

625

High side floating supply voltage

IR22141

-0.3

1225

VHO

High side floating output voltage (HOP, HON and SSDH)

VS - 0.3

VB + 0.3

VCC

Low side and logic fixed supply voltage

-0.3

COM

Power ground

VCC - 25

VCC + 0.3

VLO

Low side output voltage (LOP, LON and SSDL)

VCOM -0.3

VCC + 0.3

VIN

Logic input voltage (HIN, LIN and FLT_CLR)

-0.3

VCC + 0.3

VFLT

Fault input/output voltage (FAULT/SD and SY_FLT)

-0.3

VCC + 0.3

VDSH

High side DS input voltage

VS -3

VB + 0.3

VDSL

Low side DS input voltage

VCOM -3

VCC + 0.3

dVs/dt

Allowable offset voltage slew rate

—

V/ns

Package power dissipation @ TA ≤ 25 °C

—

1.5

RthJA

Thermal resistance, junction to ambient

—

°C/W

Junction temperature

—

150

Storage temperature

-55

150

Lead temperature (soldering, 10 seconds)

—

300

°C

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