AS5050A datasheet(5/31 Pages) AMSCO

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Page 5

[v2-03] 2014-Jul-31

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AS5050A − Absolute Maximum Ratings

Stresses beyond those listed in “Absolute Maximum Ratings” on

page 5 may cause permanent damage to the device. These are

stress ratings only, and functional operation of the device at

these or any other conditions beyond those indicated in

“Electrical Characteristics” on page 6 is not implied. Exposure

to absolute maximum rating conditions for periods may affect

device reliability.

Figure 5:

Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

VDD

DC supply voltage

-0.3

5.0

VDDp

Peripheral supply voltage

-0.3

VDD+0.3

VIN

Input pin voltage

-0.3

5.0

Iscr

Input current (latchup

immunity)

-100

100

Norm: JEDEC 78

Electrostatic Discharge

ESD

Electrostatic discharge

±1

Norm: MIL-STD-883 E method

3015

Continuous Power Dissipation

ΘJA

Package thermal resistance

33.5

°C/W

Velocity=0, Multi Layer PCB;

JEDEC Standard Testboard

Total power dissipation

Temperature Ranges and Storage Conditions

Tstrg

Storage temperature

-55

125

°C

TBODY

Package body temperature

260

°C

The reflow peak soldering

temperature (body temperature)

specified is in accordance with

IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity

Classification for Non-Hermetic

Solid State Surface Mount

Devices”.

The lead finish for Pb-free leaded

packages is matte tin (100% Sn).

Humidity non-condensing

MSL

Moisture Sensitive Level

Represents a maximum floor life

time of 168h

Absolute Maximum Ratings

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