PadDescription

PadNo.

Padname

I/O

MaskOption

Description

1

2

BZ

BZ

O

*

Soundeffectoutput

3

VDD

I

¾

Positivepowersupply

4

5

OSCI

OSCO

I

O

¾

OSCI, OSCO are connected to resistor for in-

ternalsystemclock.

6

15

16

21

T512

TEST1

TEST2

T1D

O

I

I

O

¾

Fortestmodeonly

TEST1 and TEST2 must be open when the

chip is in normal operation (with internal pull

highresistor).

7~14

COM7~COM0

O

¾

OutputforLCDpanelcommonplate

17~19

22

PS2~PS0

PS3

I

Pull-highor

None

**

4-bitportforinputonly

20

VSS

I

¾

Negativepowersupply,GND

23~25

PA2~PA0

O

CMOSor

NMOS

OpenDrain

3-bitlatchportforoutputonly

26~29

PP0~PP3

I

Pull-highor

None

**

4-bitportforinputonly

30

RES

I

¾

InputtoresetLSI

Resetisactiveatlogicallowlevel.

31~70

SEG39~SEG0

O

¾

LCDdriveroutputsforLCDpanelsegment

*:

6 internal sources deriving from system clock can be selected as sound effect clock by mask op-

tion.IfHoltek ssoundlibraryisinvoked,only128Kand64Kisaccepted.

**:

Each bit of input ports PS, PP can be a trigger source of HALT interrupt. That can be specified

bymaskoption.

AbsoluteMaximumRatings

SupplyVoltage .............................

-0.3Vto5.5V

StorageTemperature ................

-50°Cto125°C

OperatingTemperature ..................0

°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under "Absolute Maxi-

mum Ratings" may cause substantial damage to the device. Functional operation of this device

at other conditions beyond those listed in the specification is not implied and prolonged expo-

suretoextremeconditionsmayaffectdevicereliability.

HT13J0

5

May19,1999