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AN3307 Scheda tecnica(PDF) 6 Page - STMicroelectronics

Il numero della parte AN3307
Spiegazioni elettronici  Guidelines for obtaining IEC 60335 Class B certification for any STM32 application
PDF  37 Pages
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Produttore elettronici  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN3307 Scheda tecnica(HTML) 6 Page - STMicroelectronics

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Main differences between STM32F packages and their possible modifications
AN3307
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Doc ID 18186 Rev 4
2
Main differences between STM32F packages
and their possible modifications
This document describes mainly the basic STM32F1xx package; as the other packages are
its derivatives. Users can find some slight differences mainly due to the hardware deviations,
compilers and debugging tools incompatibilities. Main differences are focused on in this
section. The user can find a complete list and detailed information about STL files included
in documentation *.chm file, which is extracted and attached for each package.
CPU Tests
Register R13 is renamed to MSP (Main stack pointer) at assembly source files of the
STM32F3xx package. With the STM32F0xx package, all the instructions in the tests loading
immediate 32-bit constant operands are replaced by instructions loading constants placed
at code memory, due to restricted instruction set of ARM Cortex™-M0 core.
Clock tests and time base interval measurement
Instead of Real-time Clock (RTC) counter used in the STM32F1xx package, a sub-second
register is used at STM32F0xx and STM32F3xx packages for clock measurement due to
different implementation of RTC registers. The clock system measurement technique differs
slightly due to this fact, in these packages. Internal timers are used for cross-check
frequency measurement when this feature is available mainly to determine harmonic or
sub-harmonic frequencies if the system clock is provided by the external crystal.
SRAM tests
Some ST microcontrollers feature a built-in word protection with single bit redundancy
(hardware parity check) applied on CCM RAM or on part of SRAM, at least. This hardware
protection is one of the acceptable methods required by the IEC 60335 and IEC 60730
Class B standards. It reduces software testing overhead significantly. The applied software
SRAM March test can be removed from both startup and runtime test sets in this case. It
can be used optionally for testing the parts of RAM which are not covered by the hardware
parity check, or as a supplementary testing method. The diagnostic coverage of single bit
redundancy protection is limited to detect specific range of errors; so additional checks can
be required by the certification authority at some safety critical cases. An example could be
a combination of hardware parity protection and software March test which can be an
acceptable test of variable memory satisfying even more severe Class C criteria. The
reliability of hardware parity check can be increased, too, by other suitable methods like
using double inverse storage of safety critical information at physically separated areas (e.g.
to prevent a corruption caused by radiation or EMI which typically attacks a limited physical
memory locality).
The hardware parity check is an optional feature. When it is enabled, an unintentional parity
error event can be detected during execution of startup self-test procedure due to not
initialized parity system (e.g. case of local variables if they are allocated and read out while
using different data access to memory).



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