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MIC2182 Scheda tecnica(PDF) 17 Page - Micrel Semiconductor |
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MIC2182 Scheda tecnica(HTML) 17 Page - Micrel Semiconductor |
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17 / 28 page ![]() June 2000 17 MIC2182 MIC2182 Micrel charge can be a significant source of power dissipation in the MIC2182. At low output load this power dissipation is notice- able as a reduction in efficiency. The average current re- quired to drive the high-side MOSFET is: IQ f G[high-side](avg) G S =× where: I G[high-side](avg) = average high-side MOSFET gate current Q G = total gate charge for the high-side MOSFET taken from manufacturer’s data sheet with V GS = 5V. The low-side MOSFET is turned on and off at V DS = 0 because the freewheeling diode is conducting during this time. The switching losses for the low-side MOSFET is usually negligable. Also, the gate drive current for the low- side MOSFET is more accurately calculated using C ISS at V DS = 0 instead of gate charge. For the low-side MOSFET: IC V f G[low-side](avg) ISS GS S =× × Since the current from the gate drive comes from the input voltage, the power dissipated in the MIC2182 due to gate drive is: PV I I gate drive IN G[high-side](avg) G[low-side](avg) =+ () A convenient figure of merit for switching MOSFETs is the on- resistance times the total gate charge (R DS(on) × QG). Lower numbers translate into higher efficiency. Low gate-charge logic-level MOSFETs are a good choice for use with the MIC2182. Power dissipation in the MIC2182 package limits the maximum gate drive current. Refer to Figure 10 for the MIC2182 gate drive limits. Parameters that are important to MOSFET switch selection are: • Voltage rating • On-resistance • Total gate charge The voltage rating of the MOSFETs are essentially equal to the input voltage. A safety factor of 20% should be added to the V DS(max) of the MOSFETs to account for voltage spikes due to circuit parasitics. The power dissipated in the switching transistor is the sum of the conduction losses during the on-time (P conduction) and the switching losses that occur during the period of time when the MOSFETs turn on and off (P AC). PP P SW conduction AC =+ where: P I (rms) R conduction SW 2 SW =× PP P AC AC(off) AC(on) =+ R SW = on-resistance of the MOSFET switch. Making the assumption the turn-on and turnoff transition times are equal, the transition time can be approximated by: t CV C V I T ISS GS OSS IN G = ×+ × where: C ISS and COSS are measured at VDS = 0. I G = gate drive current (1A for the MIC2182) The total high-side MOSFET switching loss is: P(V V ) I t f AC IN D PK T S =+ × × × where: t T = switching transition time (typically 20ns to 50ns) V D = freewheeling diode drop, typically 0.5V. f S it the switching frequency, nominally 300kHz The low-side MOSFET switching losses are negligible and can be ignored for these calculations. RMS Current and MOSFET Power Dissipation Calculation Under normal operation, the high-side MOSFET’s RMS current is greatest when V IN is low (maximum duty cycle). The low-side MOSFET’s RMS current is greatest when V IN is high (minimum duty cycle). However, the maximum stress the MOSFETs see occurs during short circuit conditions, where the output current is equal to I overcurrent(max). (See the Sense Resistor section). The calculations below are for normal operation. To calculate the stress under short circuit condi- tions, substitute I overcurrent(max) for IOUT(max). Use the formula below to calculate D under short circuit conditions. D 0.063 1.8 10 V short circuit 3 IN =− × × − The RMS value of the high-side switch current is: I (rms) D I I 12 SW(highside) OUT(max) 2 PP 2 =× + I (rms) 1 D I I 12 SW(low side) OUT(max) 2 PP 2 =− () + where: D = duty cycle of the converter D V V OUT IN = × η η = efficiency of the converter. Converter efficiency depends on component parameters, which have not yet been selected. For design purposes, an efficiency of 90% can be used for V IN less than 10V and 85% can be used for V IN greater than 10V. The efficiency can be more accurately calculated once the design is complete. If the assumed efficiency is grossly inaccurate, a second iteration through the design procedure can be made. For the high-side switch, the maximum dc power dissipation is: P R I (rms) switch1(dc) DS(on)1 SW1 2 =× |
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