PACDN042

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5

PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318−08

ISSUE AR

D

A1

3

1

2

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.

MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF

THE BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS.

SOLDERING FOOTPRINT*

VIEW C

L

0.25

L1

e

E

E

b

A

SEE VIEW C

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

0.89

1.00

1.11

0.035

INCHES

A1

0.01

0.06

0.10

0.000

b

0.37

0.44

0.50

0.015

c

0.08

0.14

0.20

0.003

D

2.80

2.90

3.04

0.110

E

1.20

1.30

1.40

0.047

e

1.78

1.90

2.04

0.070

L

0.30

0.43

0.55

0.012

0.039

0.044

0.002

0.004

0.017

0.020

0.006

0.008

0.114

0.120

0.051

0.055

0.075

0.080

0.017

0.022

NOM

MAX

L1

H

2.10

2.40

2.64

0.083

0.094

0.104

0.35

0.54

0.69

0.014

0.021

0.027

c

0

−−−

10

0

−−−

10

T

°

°

°

°

T

3X

TOP VIEW

SIDE VIEW

END VIEW

2.90

0.80

DIMENSIONS: MILLIMETERS

0.90

PITCH

3X

3X

0.95

RECOMMENDED

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.