PACDN042

www.onsemi.com

7

PACKAGE DIMENSIONS

SOT−23, 6 Lead

CASE 527AJ

ISSUE A

D

A1

5

12

DETAIL A

L

E

b

A

DETAIL A

c

DIM

MIN

MAX

MILLIMETERS

A1

0.00

0.15

A2

0.90

1.30

b

0.20

0.50

c

0.08

0.26

D

2.70

3.00

E

2.50

3.10

E1

1.30

1.80

e

0.95 BSC

L2

0.25 BSC

L

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DATUM C IS THE SEATING PLANE.

0.20

0.60

A

---

1.45

3

64

E

A2

SIDE VIEW

TOP VIEW

END VIEW

A

S

A

M

0.20

6X

SEATING

PLANE

B

C

S

B

e

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

3.30

0.95

0.85

6X

DIMENSIONS: MILLIMETERS

0.56

PITCH

6X

RECOMMENDED

0.10 C

C

6X

SEATING

PLANE

L2

GAGE

PLANE