AC08FSM datasheet(151/223 Pages) TECCOR

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Application Notes

AN1005

AN1005 - 3

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Wave Soldering

Wave soldering is the most commonly used method for soldering

components in PCB assemblies. As with other soldering pro-

cesses, a flux is applied before soldering. After the flux is

applied, the surface mount devices are glued into place on a PC

board. The board is then placed in contact with a molten wave of

solder at a temperature between 240 °C and 260 °C, which

affixes the component to the board.

Dual wave solder baths are also in use. This procedure is the

same as mentioned above except a second wave of solder

removes excess solder.

Although wave soldering is the most popular method of PCB

assembly, drawbacks exist. The negative features include solder

bridging and shadows (pads and leads not completely wetted) as

board density increases. Also, this method has the sharpest ther-

mal gradient. To prevent thermal shock, some sort of pre-heating

device must be used. Figure AN1005.6 shows the procedure for

wave soldering PCBs with surface mount devices only. Figure

AN1005.7 shows the procedure for wave soldering PCBs with

both surface mount and leaded components.

Figure AN1005.6

Wave Soldering PCBs With Surface Mount Devices

Only

Figure AN1005.7

Wave Soldering PCBs With Both Surface Mount

and Leaded Components

Immersion Soldering

Maximum allowed temperature of the soldering bath is 235 °C.

Maximum duration of soldering cycle is five seconds, and forced

cooling must be applied.

Hand Soldering

It is possible to solder the DO-214, Compak, and TO-252 devices

with a miniature hand-held soldering iron, but this method has

particular drawbacks and should be restricted to laboratory use

and/or incidental repairs on production circuits.

Recommended Metal-alloy

(1) 63/37 Sn/Pb

(2) 60/40 Sn/Pb

Pre-Heating

Pre-heating is recommended for good soldering and to avoid

damage to the DO-214, Compak, TO-252 devices, other compo-

nents, and the substrate. Maximum pre-heating temperature is

165 °C while the maximum pre-heating duration may be 10 sec-

onds. However, atmospheric pre-heating is permissible for sev-

eral minutes provided temperature does not exceed 125 °C.

Screen print glue

Wave solder

Apply glue

Cure glue

Place component

PC board

Insert

leaded

components

Turn over the

PC board

Apply

glue

Place

SMDs

Cure

glue

Turn over the

PC board

Wave solder

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