AC08FSM datasheet(152/223 Pages) TECCOR

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AN1005

Application Notes

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Gluing Recommendations

Prior to wave soldering, surface mount devices (SMDs) must be

fixed to the PCB or substrate by means of an appropriate adhe-

sive. The adhesive (in most cases a multicomponent adhesive)

has to fulfill the following demands:

•

Uniform viscosity to ensure easy coating

•

No chemical reactions upon hardening in order not to deterio-

rate component and PC board

•

Straightforward exchange of components in case of repair

Low-temperature Solder for Reducing

PC Board Damage

In testing and troubleshooting surface-mounted components,

changing parts can be time consuming. Moreover, desoldering

and soldering cycles can loosen and damage circuit-board pads.

Use low-temperature solder to minimize damage to the PC board

and to quickly remove a component. One low-temperature alloy

is indium-tin, in a 50/50 mixture. It melts between 118 °C and

125 °C, and tin-lead melts at 183 °C. If a component needs

replacement, holding the board upside down and heating the

area with a heat gun will cause the component to fall off. Per-

forming the operation quickly minimizes damage to the board and

component.

Proper surface preparation is necessary for the In-Sn alloy to wet

the surface of the copper. The copper must be clean, and you

must add flux to allow the alloy to flow freely.You can use rosin

dissolved in alcohol. Perform the following steps:

(1) Cut a small piece of solder and flow it onto one of the pads.

(2) Place the surface-mount component on the pad and melt the

soldered pad to its pin while aligning the part. (This operation

places all the pins flat onto their pads.)

(3) Cut small pieces of the alloy solder and flow each piece onto

each of the other legs of the component.

Indium-tin solder is available from ACI Alloys, San Jose, CA and

Indium Corporation of America, Utica, NY.

Multi-use Footprint

Package soldering footprints can be designed to accommodate

more than one package. Figure AN1005.8 shows a footprint

design for using both the Compak and an SOT-223. Using the

dual pad outline makes it possible to use more than one supplier

source.

Cleaning Recommendations

Using solvents for PC board or substrate cleaning is permitted

from approximately 70 °C to 80 °C.

The soldered parts should be cleaned with azeotrope solvent fol-

lowed by a solvent such as methol, ethyl, or isopropyl alcohol.

Ultrasonic cleaning of surface mount components on PCBs or

substrates is possible.

The following guidelines are recommended when using ultra-

sonic cleaning:

•

Cleaning agent: Isopropanol

•

Bath temperature: approximately 30 °C

•

Duration of cleaning: MAX 30 seconds

•

Ultrasonic frequency: 40 kHz

•

Ultrasonic changing pressure: approximately 0.5 bar

Cleaning of the parts is best accomplished using an ultrasonic

cleaner which has approximately 20 W of output per one liter of

solvent. Replace the solvent on a regular basis.

Figure AN1005.8

Dual Footprint for Compak Package

MT2 / Anode

Compak

Footprint

for either

Compak

or SOT-223

Dual Pad Outline

Pad Outline

0.150

(3.8)

0.328

(8.33)

0.079

(2.0)

0.030

(.76)

0.040

(1.0)

0.019

(.48)

0.079

(2.0)

0.091

(2.31)

0.079

(2.0)

.055

(1.4)

0.059

(1.5)

TYP

0.079

(2.0)

0.079

(2.0)

0.079

(2.0)

0.110

(2.8)

0.030

(.76)

0.040

(1.0)

Gate

MT1 / Cathode

MT1

Not

used

SOT-223

Footprint

Dimensions are in inches (and millimeters).

MT2 / Anode

MT1 / Cathode

MT2 / Anode

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