ST25DV64K datasheet(12/220 Pages) STMICROELECTRONICS

12 / 220 page

List of tables

ST25DV04K ST25DV16K ST25DV64K

12/220

DocID027603 Rev 4

Table 198. Fast Read Dynamic Configuration response format when Error_flag is set . . . . . . . . . . . 167

Table 199. Fast Write Dynamic Configuration request format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168

Table 200. Fast Write Dynamic Configuration response format

when Error_flag is NOT set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168

Table 201. Fast Write Dynamic Configuration response format when Error_flag is set . . . . . . . . . . . 168

Table 202. UID format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169

Table 203. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170

Table 204. I2C operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

Table 205. AC test measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

Table 206. Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

Table 207. I2C DC characteristics up to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172

Table 208. I2C DC characteristics up to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174

Table 209. I2C AC characteristics up to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176

Table 210. I2C AC characteristics up to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177

Table 211. GPO DC characteristics up to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179

Table 212. GPO DC characteristics up to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

Table 213. GPO AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

Table 214. RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

Table 215. Operating conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182

Table 216. SO8N – 8-lead 4.9 x 6 mm, plastic small outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183

Table 217. TSSOP8 – 8-lead thin shrink small outline, 3 x 6.4 mm, 0.65 mm pitch,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184

Table 218. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch

dual flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186

Table 219. UFDFPN12 - 12-lead, 3x3 mm, 0.5 mm pitch ultra thin profile fine pitch dual

flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188

Table 220. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189

Table 221. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191

Table 222. ST25DVxxx Device select usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196

Table 223. Byte Write in user memory when write operation allowed . . . . . . . . . . . . . . . . . . . . . . . . 196

Table 224. Polling during programming after byte writing in user memory. . . . . . . . . . . . . . . . . . . . . 197

Table 225. Byte Write in user memory when write operation is not allowed. . . . . . . . . . . . . . . . . . . . 197

Table 226. Byte Write in Dynamic Register (if not Read Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198

Table 227. Polling during programming after byte write in Dynamic Register . . . . . . . . . . . . . . . . . . 198

Table 228. Byte Write in Dynamic Register if Read Only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198

Table 229. Byte Write in mailbox when mailbox is free from RF message

and fast transfer mode is activated . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199

Table 230. Byte Write in mailbox when mailbox is not free from RF message

fast transfer mode is not activated . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200

Table 231. Byte Write in System memory if I2C security session is open

and register is not RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200

Table 232. Polling during programing after byte write in System memory

if I2C security session is open and register is not RO. . . . . . . . . . . . . . . . . . . . . . . . . . . . 201

Table 233. Byte Write in System memory if I2C security session is closed

or register is RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201

Table 234. Sequential write User memory when write operation allowed

and all bytes belong to same area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202

Table 235. Polling during programing after sequential write in User memory

when write operation allowed and all bytes belong to same area. . . . . . . . . . . . . . . . . . . 202

Table 236. Sequential write in User memory when write operation allowed

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