PIMXRT406LCAE4A datasheet(15/71 Pages) NXP

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Electrical characteristics

i.MX RT1015 Crossover Processors Data Sheet for Consumer Products, Rev. 2, 03/2021

NXP Semiconductors

4.1.2

Thermal resistance

Following sections provide the thermal resistance data.

4.1.2.1

14 x 14 mm package thermal resistance

Table 8 displays the 14 x 14 mm LQFP package thermal resistance data.

ESD Damage Immunity:

Human Body Model (HBM)

Charge Device Model (CDM)

Vesd

—

1000

500

Input/Output Voltage range

Vin/Vout

-0.5

OVDD + 0.31 V

Storage Temperature range

TSTORAGE

-40

150

o C

1 OVDD is the I/O supply voltage.

Table 8. 14 x 14 mm package thermal resistance data

Rating

Test Conditions

Symbol

Value

Unit

Notes

Junction to Ambient

Natural convection

Single-layer board (1s)

RJA

oC/W

1,2

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Per JEDEC JESD51-2 with natural convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or

2s2p board, respectively.

Junction to Ambient

Natural convection

Four-layer board (2s2p)

RJA

oC/W

1,2

Junction to Ambient (@200

ft/min)

Single layer board (1s)

RJMA

oC/W

1,3

3 Per JEDEC JESD51-6 with forced convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or

2s2p board, respectively.

Junction to Ambient (@200

ft/min)

Four layer board (2s2p)

RJMA

oC/W

1,3

Junction to Board

—

RJB

oC/W

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

Junction to Case

—

RJC

oC/W

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

Junction to Package Top

Natural Convection

JT

oC/W

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Table 7. Absolute maximum ratings (continued)

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