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PIMXRT406LCAE4A Scheda tecnica(PDF) 22 Page - NXP Semiconductors

Il numero della parte PIMXRT406LCAE4A
Spiegazioni elettronici  i.MX RT1020 Crossover Processors for Industrial Products
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Produttore elettronici  NXP [NXP Semiconductors]
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i.MX RT1020 Crossover Processors for Industrial Products, Rev. 2, 03/2021
22
NXP Semiconductors
Electrical characteristics
The decision of choosing a clock source should be taken based on real-time clock use and precision
time-out.
4.1.5
Maximum supply currents
The data shown in Table 13 represent a use case designed specifically to show the maximum current
consumption possible. All cores are running at the defined maximum frequency and are limited to L1
cache accesses only to ensure no pipeline stalls. Although a valid condition, it would have a very limited
practical use case, if at all, and be limited to an extremely low duty cycle unless the intention was to
specifically show the worst case power consumption.
See the i.MX RT1020 Power Consumption Measurement Application Note for more details on typical
power consumption under various use case definitions.
Table 13. Maximum supply currents
Power Rail
Conditions
Max Current
Unit
DCDC_IN
Max power for chip at 105oC with core
mark run on FlexRAM
90
mA
VDD_HIGH_IN
Include internal loading in analog
50
mA
VDD_SNVS_IN
—
250
A
USB_OTG1_VBUS
25 mA for each active USB interface
25
mA
VDDA_ADC_3P3
3.3 V power supply for 12-bit ADC, 600
A typical, 750 A max, for each ADC.
100 Ohm max loading for touch panel,
cause 33 mA current.
40
mA
NVCC_GPIO
NVCC_SD0
Imax = N x C x V x (0.5 x F)
Where:
N—Number of IO pins supplied by the power line
C—Equivalent external capacitive load
V—IO voltage
(0.5 x F)—Data change rate. Up to 0.5 of the clock rate (F)
In this equation, Imax is in Amps, C in Farads, V in Volts, and F in Hertz.



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