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ADL6316ACCZ-R7 Scheda tecnica(PDF) 22 Page - Analog Devices |
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ADL6316ACCZ-R7 Scheda tecnica(HTML) 22 Page - Analog Devices |
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22 / 37 page ![]() ADL6316 Data Sheet Rev. 0 | Page 22 of 37 –10 0 –20 –30 –40 –50 –60 –70 –80 –90 –100 –75.2dBc –71.5dBc –71.4dBc –75.6dBc CENTER 960MHz RESOLUTION BW 30kHz SPAN 24.52MHz SWEEP 103.9ms VIDEO BW 30kHz 4.8dBm REF 0.0dBm Figure 44. LTE Carrier, Adjacent and Alternate CPR at 960 MHz, VVA Attenuation = 0 dB, DSA Attenuation = 10.5dB, PIN = -14.9 dBm –90 –80 –70 –60 –50 –40 –30 –8 –6 –4 –2 0 2 4 6 8 10 12 14 16 OUTPUT POWER (dBm) ADJACENT CPR ALTERNATE CPR Figure 45. Adjacent and Alternate Channel Power Ratio vs. Output Power (POUT) by PIN at 960 MHz, LTE Test Model 1.1 (TM1.1), VVA Attenuation = 0 dB, DSA Attenuation = 0 dB –90 –80 –70 –60 –50 –40 –30 –8 –6 –4 –2 0 2 4 6 8 10 12 14 16 OUTPUT POWER (dBm) ADJACENT CPR ALTERNATE CPR Figure 46. Adjacent and Alternate Channel Power Ratio vs. Output Power (POUT) by VVA Attenuation at 960 MHz, LTE TM1.1, PIN = −14.9 dBm, DSA Attenuation = 0 dB –90 –80 –70 –60 –50 –40 –30 –2 0 2 4 6 8 10 12 14 16 OUTPUT POWER (dBm) ADJACENT CPR ALTERNATE CPR Figure 47. Adjacent and Alternate Channel Power Ratio vs. Output Power (POUT) by DSA Attenuation at 960 MHz, LTE TM1.1, PIN = −14.9 dBm, VVA Attenuation = 0 dB LAYOUT Solder the exposed pad on the underside of the ADL6316 to a low thermal and electrical impedance ground plane. This pad is typically soldered to an exposed opening in the solder mask on the evaluation board. Notice the use of 19 via holes on the exposed pad of the ADL6316-EVALZ evaluation board. Connect these ground vias to all other ground layers on the evaluation board to maximize heat dissipation from the device package. For more information on the ADL6316-EVALZ evaluation board, contact Analog Devices, Inc. Ensure that the decoupling capacitors are located close to the supply voltage pins. Figure 48. Evaluation Board Layout for the ADL6316-EVALZ |
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