ST25DV64KC datasheet(202/203 Pages) STMICROELECTRONICS

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Figure 52.

Reset to Ready frame exchange between VCD and ST25DVxxKC .............................. 103

Figure 53.

Write AFI frame exchange between VCD and ST25DVxxKC................................... 104

Figure 54.

Lock AFI frame exchange between VCD and ST25DVxxKC ................................... 105

Figure 55.

Write DSFID frame exchange between VCD and ST25DVxxKC ................................ 106

Figure 56.

Lock DSFID frame exchange between VCD and ST25DVxxKC................................. 107

Figure 57.

Get System Info frame exchange between VCD and ST25DVxxKC .............................. 109

Figure 58.

Extended Get System Info frame exchange between VCD and ST25DVxxKC........................113

Figure 59.

Get Multiple Block Security Status frame exchange between VCD and ............................114

Figure 60.

Extended Get Multiple Block Security Status frame exchange between VCD and ST25DVxxKC ...........116

Figure 61.

Read Configuration frame exchange between VCD and ST25DVxxKC ............................117

Figure 62.

Write Configuration exchange between VCD and ST25DVxxKC .................................119

Figure 63.

Read Dynamic Configuration frame exchange between VCD and ST25DVxxKC ..................... 120

Figure 64.

Write Dynamic Configuration frame exchange between VCD and ST25DVxxKC ..................... 121

Figure 65.

Manage GPO frame exchange between VCD and ST25DVxxKC ............................... 122

Figure 66.

Write Message frame exchange between VCD and ST25DVxxKC............................... 123

Figure 67.

Read Message Length frame exchange between VCD and ST25DVxxKC ......................... 124

Figure 68.

Read Message frame exchange between VCD and ST25DVxxKC .............................. 125

Figure 69.

Fast Read Message frame exchange between VCD and ST25DVxxKC ........................... 126

Figure 70.

Write Password frame exchange between VCD and ST25DVxxKC .............................. 128

Figure 71.

Present Password frame exchange between VCD and ST25DVxxKC ............................ 129

Figure 72.

Fast Read Single Block frame exchange between VCD and ST25DVxxKC......................... 130

Figure 73.

Fast Extended Read Single Block frame exchange between VCD and ST25DVxxKC ................. 131

Figure 74.

Fast Read Multiple Block frame exchange between VCD and ST25DVxxKC........................ 133

Figure 75.

Fast Extended Read Multiple Block frame exchange between VCD and ST25DVxxKC ................ 134

Figure 76.

Fast Write Message frame exchange between VCD and ST25DVxxKC ........................... 136

Figure 77.

Fast Read Message Length frame exchange between VCD and ST25DVxxKC...................... 137

Figure 78.

Fast Read Dynamic configuration frame exchange between VCD and ST25DVxxKC.................. 138

Figure 79.

Fast Write Dynamic Configuration frame exchange between VCD and ST25DVxxKC ................. 139

Figure 80.

AC test measurement I/O waveform ................................................... 142

Figure 81.

I2C AC waveforms ............................................................... 148

Figure 82.

I2C Fast mode (fC = 1 MHz): maximum Rbus value versus bus parasitic capacitance (Cbus) ............. 148

Figure 83.

ASK modulated signal ............................................................. 151

Figure 84.

SO8N – Outline ................................................................. 152

Figure 85.

SO8N - Recommended footprint ...................................................... 153

Figure 86.

TSSOP8 – Outline ............................................................... 154

Figure 87.

TSSOP8 – Recommended footprint.................................................... 155

Figure 88.

UFDFN8 - Outline ................................................................ 156

Figure 89.

WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale package outline .............. 158

Figure 90.

WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale recommended footprint......... 159

Figure 91.

UFDFPN12 - Outline .............................................................. 160

Figure 92.

Logic 0, high data rate, fast commands ................................................. 162

Figure 93.

Logic 1, high data rate, fast commands ................................................. 162

Figure 94.

Logic 0, low data rate, fast commands .................................................. 162

Figure 95.

Logic 1, low data rate, fast commands .................................................. 163

Figure 96.

Start of frame, high data rate, one subcarrier, fast commands .................................. 163

Figure 97.

Start of frame, low data rate, one subcarrier, fast commands .................................. 163

Figure 98.

End of frame, high data rate, one subcarrier, fast commands .................................. 164

Figure 99.

End of frame, low data rate, one subcarrier, fast commands ................................... 164

ST25DV04KC ST25DV16KC ST25DV64KC

List of figures

DS13519 - Rev 3

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