MIMXRT406LCFP4A datasheet(70/72 Pages) NXP

70 / 72 page

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of customer’s

third party customer(s). Customers should provide appropriate design and

operating safeguards to minimize the risks associated with their applications

and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary testing

for the customer’s applications and products using NXP Semiconductors

products in order to avoid a default of the applications and the products or of the

application or use by customer’s third party customer(s). NXP does not accept

any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect the

quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products

are sold subject to the general terms and conditions of commercial sale,

as published at http://www.nxp.com/profile/terms, unless otherwise agreed

in a valid written individual agreement. In case an individual agreement

is concluded only the terms and conditions of the respective agreement

shall apply. NXP Semiconductors hereby expressly objects to applying the

customer’s general terms and conditions with regard to the purchase of NXP

Semiconductors products by customer.

Bare die — All die are tested on compliance with their related technical

specifications as stated in this data sheet up to the point of wafer sawing

and are handled in accordance with the NXP Semiconductors storage and

transportation conditions. If there are data sheet limits not guaranteed, these

will be separately indicated in the data sheet. There are no post-packing tests

performed on individual die or wafers.

NXP Semiconductors has no control of third party procedures in the sawing,

handling, packing or assembly of the die. Accordingly, NXP Semiconductors

assumes no liability for device functionality or performance of the die or

systems after third party sawing, handling, packing or assembly of the die. It is

the responsibility of the customer to test and qualify their application in which

the die is used.

All die sales are conditioned upon and subject to the customer entering

into a written die sale agreement with NXP Semiconductors through its

legal department.

Export control — This document as well as the item(s) described herein may be

subject to export control regulations. Export might require a prior authorization

from competent authorities.

Translations — A non-English (translated) version of a document, including

the legal information in that document, is for reference only. The English

version shall prevail in case of any discrepancy between the translated and

English versions.

Security — Customer understands that all NXP products may be subject to

unidentified vulnerabilities or may support established security standards or

specifications with known limitations. Customer is responsible for the design

and operation of its applications and products throughout their lifecycles

to reduce the effect of these vulnerabilities on customer’s applications

and products. Customer’s responsibility also extends to other open and/or

proprietary technologies supported by NXP products for use in customer’s

applications. NXP accepts no liability for any vulnerability. Customer should

regularly check security updates from NXP and follow up appropriately.

Customer shall select products with security features that best meet rules,

regulations, and standards of the intended application and make the

ultimate design decisions regarding its products and is solely responsible

for compliance with all legal, regulatory, and security related requirements

concerning its products, regardless of any information or support that may be

provided by NXP.

NXP has a Product Security Incident Response Team (PSIRT) (reachable

at PSIRT@nxp.com) that manages the investigation, reporting, and solution

release to security vulnerabilities of NXP products.

Trademarks

Notice: All referenced brands, product names, service names, and

trademarks are the property of their respective owners.

NXP — wordmark and logo are trademarks of NXP B.V.

NXP Semiconductors

Legal information

i.MX RT1015 Crossover Processors Data Sheet for Consumer Products, Rev. 3.1, 03/2022

MIMXRT406LCFP4A Scheda tecnica(PDF) 70 Page - NXP Semiconductors

MIMXRT406LCFP4A Scheda tecnica(HTML) 70 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72

Scheda tecnica Scarica

Link URL