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ADRF5080BCCZN-R7 Scheda tecnica(PDF) 5 Page - Analog Devices

Il numero della parte ADRF5080BCCZN-R7
Spiegazioni elettronici  Reflective, Silicon SP8T Switch, 100 MHz to 20 GHz
PDF  15 Pages
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Produttore elettronici  AD [Analog Devices]
Homepage  http://www.analog.com
Logo AD - Analog Devices

ADRF5080BCCZN-R7 Scheda tecnica(HTML) 5 Page - Analog Devices

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Data Sheet
ADRF5080
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. 0 | 5 of 15
For recommended operating conditions, see Table 1 and Table 2.
Table 3. Absolute Maximum Ratings
Parameter
Rating
Supply Voltage
VDD
−0.3 V to +3.6 V
VSS
−3.6 V to +0.3 V
Digital Control Input1
Voltage
−0.3 V to VDD + 0.3 V
Current
3 mA
RF Input Power2
Dual Supply (VDD = 3.3 V, VSS = −3.3 V, f = 100 MHz
to 20 GHz, TCASE = 85°C3)
Through Path
33.5 dBm
Hot Switching
30.5 dBm
Single Supply (VDD = 3.3 V, VSS = 0 V, f = 100 MHz
to 20 GHz, TCASE = 85°C3)
Through Path
15.5 dBm
Hot Switching
9.5 dBm
Unbiased (VDD, VSS = 0V )
10.5 dBm
Temperature
Junction (TJ)
135°C
Storage
−65°C to +150°C
Reflow
260°C
1 Overvoltages at digital control inputs are clamped by internal diodes. Current
must be limited to the maximum rating given.
2 For power derating over frequency, see Figure 2 and Figure 3.
3 For 105°C operation, the power handling degrades from the TCASE = 85°C
specification by 3 dB.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to PCB
thermal design is required. θJC is the junction to case bottom
(channel to package bottom) thermal resistance.
Table 4. Thermal Resistance
Package Type
θJC1
Unit
CC-36-2
Insertion Loss Path
130
°C/W
1 θJC was determined by simulation under the following conditions: the heat
transfer is due solely to thermal conduction from the channel through the
round pad to the PCB, and the ground pad is held constant at the operating
temperature of 85°C.
POWER DERATING CURVES
Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C
Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C



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