ADA4510-2ARMZ-R7 datasheet(31/32 Pages) AD

Il numero della parte	ADA4510-2ARMZ-R7

Spiegazioni elettronici	Precision, 40 V, ±70 nV/°C, Rail-to-Rail Input and Output Op Amp with DigiTrim

PDF	32 Pages

Scroll/Zoom	100%

Produttore elettronici	AD [Analog Devices]

Homepage	http://www.analog.com

Logo

31 / 32 page

Data Sheet

ADA4510-2

APPLICATIONS INFORMATION

analog.com

Rev. B | 31 of 32

chanical stresses can arise from differences of coefficient of thermal

expansion (CTE), the rate at which different materials expand when

exposed to heat. During the soldering process, the rapidly changing

high temperatures cause the packaging materials surrounding the

silicon die to expand at a different rate from the silicon. This mis-

match in expansion exerts mechanical stress on the die, which can

affect the component electrical properties and cause performance

shift if not mitigated.

By baking the PCB assembly for 30 minutes at 125°C after reflow

soldering, adverse effects of mechanical stress on the ADA4510-2

can be effectively mitigated ensuring optimal specified performance.

Figure 92 shows how the VOS of representative ADA4510-2 opera-

tional amplifiers is affected by stimulated high temperature reflow

(SHR) and subsequent post solder bake.

Figure 92. VOS Shift due to Solder Heat

ADA4510-2ARMZ-R7 Scheda tecnica(PDF) 31 Page - Analog Devices