ADL5309ACBZ-R7 datasheet(5/25 Pages) AD

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Data Sheet

ADL5309

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 5 of 25

Table 3. Absolute Maximum Ratings

Parameter

Rating

VCC

5.5 V

Current into INP1 and INP2

100 mA

DC Voltage

SDA and SCL

−0.3 V to 5.5 V

SBA, PDB1, and PDB2

−0.3 V to VCC + 0.3 V

SUM, INP1, INP2, OUT1, OUT2, CAP, and

ADCREF

−0.3 V to +3.0 V

Output Short Circuit Duration

OUT1, OUT2, PDB1, and PDB2

Indefinite

Temperature

Operating TA Range

−40°C to +105°C

Maximum TJ

135°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJA is the natural junction to ambient thermal resistance measured

in a one cubic foot sealed enclosure.

Table 4. Thermal Resistance

Package Type1

θJA

Unit

CB-20-16

61.6

°C/W

1 Test Condition 1: Thermal impedance simulated values are based upon use of

a JEDEC 2S2P thermal test board.

ELECTROSTATIC DISCHARGE (ESD) RATING

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD-protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charged-device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002.

ESD Ratings for ADL5309

Table 5. ADL5309, 20-Lead WLCSP

ESD Model

Withstand Threshold (V)

Class

HBM

2500

FICDM

1250

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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