DRV8860, DRV8860A

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SLRS065E – SEPTEMBER 2013 – REVISED NOVEMBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Power supply voltage range

VM

–0.3

40

V

Digital input pin current range

ENABLE, LATCH, CLK, DIN

0

20

mA

Digital output pin voltage range

DOUT, nFAULT

–0.5

7

V

Digital output pin current

DOUT, nFAULT

–0.5

7

V

Output voltage range

OUTx

–0.3

40

V

Output current range

OUTx

Internally limited

A

Operating virtual junction temperature range, TJ

–40

150

°C

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

(3)

Power dissipation and thermal limits must be observed

7.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–60

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–2

2

kV

pins (1)

V(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC specification

–500

500

V

JESD22-C101, all pins (2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VM

Motor power supply voltage range

8

38

V

IOUT

Low-side driver current capability

560

mA

TA

Operating ambient temperature range

–40

85

°C

7.4 Thermal Information

(1)

over operating free-air temperature range (unless otherwise noted)

TSSOP

HTSSOP

THERMAL METRIC

UNIT

PW (16 PINS)

PWP (16 PINS)

ΘJA

Junction-to-ambient thermal resistance

103

40.9

°C/W

RθJC(TOP)

Junction-to-case (top) thermal resistance

37.9

28.5

°C/W

RθJB

Junction-to-board thermal resistance

48

23.2

°C/W

ΨJT

Junction-to-top characterization parameter

3

0.9

°C/W

ΨJB

Junction-to-board characterization parameter

47.4

23.0

°C/W

RθJC(BOTTOM)

Junction-to-case (bottom) thermal resistance

N/A

3.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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