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AS7225 Scheda tecnica(PDF) 71 Page - ams-OSRAM AG |
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AS7225 Scheda tecnica(HTML) 71 Page - ams-OSRAM AG |
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71 / 76 page ![]() Document Feedback AS7225 Soldering & Storage Information Datasheet • PUBLIC DS000496 • v2-00 • 2019-Jun-28 75 │ 70 16 Soldering & Storage Information The module has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of the component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 94: Solder Reflow Profile Graph Figure 95: Solder Reflow Profile Parameter Reference Device Average temperature gradient in preheating 2.5 °C/s Soak time tsoak 2 to 3 minutes Time above 217 °C (T1) t1 Max 60 s Time above 230 °C (T2) t2 Max 50 s T1 T2 T3 TPEAK Time in seconds tSOAK t1 t2 t3 Not to scale |
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